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Barebone small form factor - Build your own PC

Shuttle Inc. Product

Cube

SKU: SZ270R9

High-end Mini PC with OC Features: Designed for gamers.

Our runrate products are barebone but we also configure specs based on your specific requirements:

  • Black aluminium chassis with plastic front panel
    Gaming style front panel with software controlled RGB-LED lighting
    Kensington Security Slot at the back panel (also called K-Slot
    or Kensington lock) as a part of an anti-theft system
    Dimensions without the 7 mm rubber feet:
    348.4 x 215.4 x 190.2 mm (LWH), 14.3-litre
    Weight: 3.5 kg net / 5.0 kg gross
  • Storage bays: 4 x 3.5″ (internal)
    Using the optional accessory PHD3 two 2.5″ drives can be installed into one 3.5″ bay
  • Shuttle Mainboard “FZ270”, Shuttle Form Factor
    proprietary design for XPC cube Barebone SZ270R9
    Dimensions: 270 x 195 mm
    Chipset: Intel® Z270 Chipset, code name “Union Point”
    Platform Controller Hub (PCH) as Single-Chip-Solution
    Solid Capacitors for sensitive areas provide excellent
    heat resistance for enhanced system durability

 

  • AMI BIOS, SPI Interface, 32 MBit Flash-ROM with SPI interface
    Supports PnP, ACPI 3.0, Hardware Monitoring
    Supports Unified Extensible Firmware Interface (UEFI)
    Supports boot-up from external USB flash memory
  • Built-in 500 Watt mini switching power supply (PC63J)
    AC input voltage: supports 100~240V, 50~60 Hz
    80 PLUS Silver compliant: the PSU provides at least
    85/89/85% of efficiency at 20/50/100% of load.
    Active PFC circuit (Power Factor Correction)
    ATX main power connectors: 2x 10 and 2x 2-pin
    Graphics power connector: 6-pin and 8-pin
    Other connectors: 4x SATA, 2x Molex, 1x Floppy
  • This system comes without operating system.
    It is compatible with Windows 7 / 10 and Linux (64-bit).
    Note: Windows 7 is only supported in combination with 6th generation Intel Core
    processors “Skylake”.
    Additional note on Windows 7 see [7]
  • Socket LGA 1151 (H4) supports
    Intel Core i7 / i5 / i3, Pentium and Celeron processors
    – 6th generation, code name “Skylake”
    – 7th generation, code name “Kaby Lake”
    Maximum supported processor power consumption (TDP) = 95 W
    14 nm process technology, up to 8 MB of L3 cache
    Not compatible with Intel Xeon E3 V5 processors for socket LGA 1151 and processors
    with the older Socket LGA 1150.
    Supports the unlock function of Intel K-Series processors.
    The processor integrates PCI-Express, memory controller and the graphics engine on
    the same die (performance features depending on processor type)
    Please refer to the support list for detailed processor support information at
    global.shuttle.com.
  • Shuttle I.C.E. (Integrated Cooling Engine)
    Advanced I.C.E. Heatpipe technology with 4 pipes
    Temperature controlled 92 mm fan
    SilentX cooling and noise reduction technology with Active Airflow
  • 4 x 288-pin slot
    Supports DDR4-2133/2400 memory (PC4-17066/19200) at 1.2V
    Supports 2+2 Dual Channel mode
    Supports max. 16 GB per DIMM, maximum total size of 64 GB

 

  • The features of the integrated Intel HD graphics function
    depend on the processor type used.
    Supports DirectX 12, OGL 5.x, OCL 2.x
    The PC features three digital video outputs:
    – HDMI v1.4b (supports 1080p/60 and 2160p/30)
    – 2x DisplayPort v1.2 (support 1080p/60 and 2160p/60)
    Supports displays with 4K Ultra HD resolution at 3840 x 2160 [3]
    Supports three independent Full HD displays with the integrated graphics function
    Supports more displays in combination with a discrete graphics card [2]
    Supports Blu-ray (BD) playback with HDCP copy protection
    Supports multi-channel digital audio over the same cable
    Maximum shared memory of 512 MB

 

1x PCI-Express x16 v3.0 slot (PEG, for graphics cards only)
1x PCI-Express x4 v3.0 slot
This XPC supports dual-slot (double-width) graphics cards. Using one will occupy the
second PCI-Express slot.
The length of the graphics cards can be up to 280 mm
or 273 mm, if the power connectors are on the back side.
Graphics power connectors: 6-pin and 8-pin

 

  • The mainboard provides two M.2 2280 slots with the following interfaces:
    – PCI-Express Gen. 3.0 X4 with up to 32 Gbps Data Transfer Speed
    – SATA v3.0 (max. 6 Gbps)
    It supports M.2 cards with a width of 22 mm
    and a length of 42, 60 or 80 mm (type 2242, 2260, 2280).
    Supports M.2 SSDs with SATA or PCI-Express interface.
    Prepared for Intel® Optane™ Technology.
  • The SZ270R9 supports Intel® Optane™ Technology
    which accelerates the speed of one hard disk through data caching.
    This requires a 7th gen. Intel Core processor (“Kaby Lake”)
    and an Optane-SSD with 3D-Xpoint memory (e.g. in M.2 format).
  • Interfaces: PCI-Express Gen. 2.0 X1 and USB 2.0
    Supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
    Supports WLAN expansion cards (optional Shuttle accessory WLN-M [6])
  • High Definition Audio with Realtek ALC662 codec
    Back panel: three analog audio connectors (3.5 mm):
    Line-in (blue), line-out (green) and microphone input (pink)
    shared with 5.1 channel line-out (front, rear, center/bass)
    Front panel: microphone input and headphones output
    7.1 channel Digital Audio: via HDMI and DisplayPort outputs

 

  • Dual network with two RJ45 ports
    2x Intel i211 Ethernet Controller with MAC, PHY and PCIe interface
    Supports 10 / 100 / 1.000 MBit/s operation
    Supports WAKE ON LAN (WOL)
    Supports network boot by Preboot eXecution Environment (PXE)
  • The mainboard provides five Serial-ATA 3.0 interfaces, max. 6 Gbps supported
    4x Serial ATA connector onboard
    Supports Intel Rapid Storage Technology (RST, Raid 0/1/5/10, JBOD)

 

  • Microphone input
    Headphones output (line-out)
    2x USB 3.0
    Power button with Power indicator (blue LED)
    Turbo button to activate overclocking mode [8]
    Front RGB-LED lighting (configurable with Shuttle OC-Tool)
  • 1x HDMI v1.4b
    2x DisplayPort v1.2 [4]
    4x USB 3.0
    4x USB 2.0
    2x Gigabit LAN (RJ45)
    3x Audio 3.5 mm (Line-in, Line-out, Microphone-in)
    Clear CMOS button
    Optional: 1x Serial port RS-232 (Accessory: H-RS232)
    3x perforation for optional WLAN antennas (Accessory: WLN-M)
  • 2x USB 2.0 (2x 5-pin)
    1x RS232 (2x 5-pin) for optional accessory H-RS232
    2x fan connector (4-pin), both connectors are occupied
    Occupied front connectors: USB 3.0, USB 2.0, audio, power buttons, LEDs
  • Multi-language XPC Installation Guide (EN, DE, FR, ES, JP, KR, SC, TC)
    32/64-bit driver disk for Windows
    4x Serial ATA cables
    AC Power Cord (with protective-earth contacts)
    Heatsink Compound
    Protector cap for the CPU socket (do not use if heatpipe or fan is mounted)
    Bag with screws

PHD3: 3.5″ to 2.5″ adapter
H-RS232: Backpanel COM port adapter for RS232 serial interface
WLN-M: Wireless LAN 802.11ac + BT4.0 module with two external antennas [6]

  • Operating temperature range: 0~40 °C
    Relative humidity range: 10~90 % (non-condensing)
  • EMI: FCC, CE, BSMI, C-Tick
    Safety: ETL, CB, BSMI
    Other: RoHS, Energy Star, ErP
    This device is classed as a technical information equipment (ITE) in class B and is
    intended for use in living room and office. The CE-mark approves the conformity by the
    EU directives:
    (1) 2004/108/EC relating to electromagnetic compatibility (EMC),
    (2) 2006/95/EC relating to Electrical Equipment designed for use within certain voltage
    limits (LVD),
    (3) 2009/125/EC relating to ecodesign requirements for energy-related products (ErP)

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