Cube
SKU: SZ270R9
High-end Mini PC with OC Features: Designed for gamers.
- Black aluminium chassis with plastic front panel Gaming style front panel with software controlled RGB-LED lighting
Kensington Security Slot at the back panel (also called K-Slot
or Kensington lock) as a part of an anti-theft system - Dimensions without the 7 mm rubber feet:
- 348.4 x 215.4 x 190.2 mm (LWH), 14.3-litre
- Weight: 3.5 kg net / 5.0 kg gross
- Storage bays: 4 x 3.5″ (internal)
Using the optional accessory PHD3 two 2.5″ drives can be installed into one 3.5″ bay
- Shuttle Mainboard “FZ270”, Shuttle Form Factor
proprietary design for XPC cube Barebone SZ270R9 - Dimensions: 270 x 195 mm
- Chipset: Intel® Z270 Chipset, code name “Union Point”
- Platform Controller Hub (PCH) as Single-Chip-Solution
- Solid Capacitors for sensitive areas provide excellent
- Heat resistance for enhanced system durability
- AMI BIOS, SPI Interface, 32 MBit Flash-ROM with SPI interface
- Supports PnP, ACPI 3.0, Hardware Monitoring
- Supports Unified Extensible Firmware Interface (UEFI)
- Supports boot-up from external USB flash memory
- Built-in 500 Watt mini switching power supply (PC63J)
- AC input voltage: supports 100~240V, 50~60 Hz
- 80 PLUS Silver compliant: the PSU provides at least
- 85/89/85% of efficiency at 20/50/100% of load.
- Active PFC circuit (Power Factor Correction)
- ATX main power connectors: 2x 10 and 2x 2-pin
- Graphics power connector: 6-pin and 8-pin
- Other connectors: 4x SATA, 2x Molex, 1x Floppy
- This system comes without operating system.
- It is compatible with Windows 7 / 10 and Linux (64-bit).
- Note: Windows 7 is only supported in combination with 6th generation Intel Core
processors “Skylake”. - Additional note on Windows 7 see [7]
- Socket LGA 1151 (H4) supports
Intel Core i7 / i5 / i3, Pentium and Celeron processors 6th generation, code name “Skylake” 7th generation, code name “Kaby Lake” Maximum supported processor power consumption (TDP) = 95 W - 14 nm process technology, up to 8 MB of L3 cache
- Not compatible with Intel Xeon E3 V5 processors for socket LGA 1151 and processors
with the older Socket LGA 1150. - Supports the unlock function of Intel K-Series processors.
- The processor integrates PCI-Express, memory controller and the graphics engine onthe same die (performance features depending on processor type)
Please refer to the support list for detailed processor support information at
global.shuttle.com.
- Shuttle I.C.E. (Integrated Cooling Engine)
- Advanced I.C.E. Heatpipe technology with 4 pipes
- Temperature controlled 92 mm fan
SilentX cooling and noise reduction technology with Active Airflow
- 4 x 288-pin slot
- Supports DDR4-2133/2400 memory (PC4-17066/19200) at 1.2V
- Supports 2+2 Dual Channel mode
- Supports max. 16 GB per DIMM, maximum total size of 64 GB
- The features of the integrated Intel HD graphics function
depend on the processor type used. - Supports DirectX 12, OGL 5.x, OCL 2.x
- The PC features three digital video outputs:
- HDMI v1.4b (supports 1080p/60 and 2160p/30)
- 2x DisplayPort v1.2 (support 1080p/60 and 2160p/60)
- Supports displays with 4K Ultra HD resolution at 3840 x 2160 [3]
- Supports three independent Full HD displays with the integrated graphics function
- Supports more displays in combination with a discrete graphics card [2]
- Supports Blu-ray (BD) playback with HDCP copy protection
- Supports multi-channel digital audio over the same cable
- Maximum shared memory of 512 MB
- 1x PCI-Express x16 v3.0 slot (PEG, for graphics cards only)
- 1x PCI-Express x4 v3.0 slot
- This XPC supports dual-slot (double-width) graphics cards. Using one will occupy the
second PCI-Express slot. - The length of the graphics cards can be up to 280 mm
or 273 mm, if the power connectors are on the back side. - Graphics power connectors: 6-pin and 8-pin
- The mainboard provides two M.2 2280 slots with the following interfaces:
- PCI-Express Gen. 3.0 X4 with up to 32 Gbps Data Transfer Speed
- SATA v3.0 (max. 6 Gbps)
- It supports M.2 cards with a width of 22 mm
and a length of 42, 60 or 80 mm (type 2242, 2260, 2280). - Supports M.2 SSDs with SATA or PCI-Express interface.
- Prepared for Intel® Optane™ Technology.
- The SZ270R9 supports Intel® Optane™ Technology
which accelerates the speed of one hard disk through data caching.
This requires a 7th gen. Intel Core processor (“Kaby Lake”)
and an Optane-SSD with 3D-Xpoint memory (e.g. in M.2 format).
- Interfaces: PCI-Express Gen. 2.0 X1 and USB 2.0
- Supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
- Supports WLAN expansion cards (optional Shuttle accessory WLN-M [6])
- High Definition Audio with Realtek ALC662 codec
- Back panel: three analog audio connectors (3.5 mm): Line-in (blue), line-out (green) and microphone input (pink)
shared with 5.1 channel line-out (front, rear, center/bass) - Front panel: microphone input and headphones output
7.1 channel Digital Audio: via HDMI and DisplayPort outputs
- Dual network with two RJ45 ports
- 2x Intel i211 Ethernet Controller with MAC, PHY and PCIe interface
- Supports 10 / 100 / 1.000 MBit/s operation
- Supports WAKE ON LAN (WOL)
- Supports network boot by Preboot eXecution Environment (PXE)
- The mainboard provides five Serial-ATA 3.0 interfaces, max. 6 Gbps supported
- 4x Serial ATA connector onboard
- Supports Intel Rapid Storage
- Technology (RST, Raid 0/1/5/10, JBOD)
- Microphone input
- Headphones output (line-out)
- 2x USB 3.0
Power button with Power indicator (blue LED) - Turbo button to activate overclocking mode [8]
- Front RGB-LED lighting (configurable with Shuttle OC-Tool)
- 1x HDMI v1.4b
- 2x DisplayPort v1.2 [4]
- 4x USB 3.0
- 4x USB 2.0
- 2x Gigabit LAN (RJ45)
- 3x Audio 3.5 mm (Line-in, Line-out, Microphone-in)
- Clear CMOS button
- Optional: 1x Serial port RS-232 (Accessory: H-RS232)
- 3x perforation for optional WLAN antennas (Accessory: WLN-M)
- 2x USB 2.0 (2x 5-pin)
- 1x RS232 (2x 5-pin) for optional accessory H-RS232
- 2x fan connector (4-pin), both connectors are occupied
- Occupied front connectors: USB 3.0, USB 2.0, audio, power buttons, LEDs
- Multi-language XPC Installation Guide (EN, DE, FR, ES, JP, KR, SC, TC)
- 32/64-bit driver disk for Windows
- 4x Serial ATA cables
- AC Power Cord (with protective-earth contacts)
- Heatsink Compound
- Protector cap for the CPU socket (do not use if heatpipe or fan is mounted)
Bag with screws
- PHD3: 3.5″ to 2.5″ adapter
- H-RS232: Backpanel COM port adapter for RS232 serial interface
- WLN-M: Wireless LAN 802.11ac + BT4.0 module with two external antennas [6]
- Operating temperature range: 0~40 °C
- Relative humidity range: 10~90 % (non-condensing)
- EMI: FCC, CE, BSMI, C-Tick
- Safety: ETL, CB, BSMI
- Other: RoHS, Energy Star, ErP
- This device is classed as a technical information equipment (ITE) in class B and is
intended for use in living room and office. The CE-mark approves the conformity by the
EU directives:- 2004/108/EC relating to electromagnetic compatibility (EMC)
- 2006/95/EC relating to Electrical Equipment designed for use within certain voltage
limits (LVD) - 2009/125/EC relating to ecodesign requirements for energy-related products (ErP)
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